发明名称 TRANSFER MECHANISM AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a transfer mechanism which enhances productivity of electronic component, by reducing distortion in the arrangement when printing a conductive film becoming the internal electrode of an electronic component on a ceramic green sheet, and to provide a method of manufacturing an electronic component using the same.SOLUTION: A transfer mechanism 10 includes a processing mechanism 40, i.e., an electrode forming mechanism for forming a conductive film pattern on a long sheet 12 consisting of a carrier film 14 and a ceramic green sheet 16 formed thereon, an unwinding roller 22 for unwinding the long sheet 12 to the upstream side of the processing mechanism 40, and a take-up roller 32 for taking up the long sheet 12 to the downstream side of the processing mechanism 40. The transfer mechanism operates so that the distance between a portion of the long sheet 12 located on the upstream side of the processing mechanism 40, and a portion of the long sheet 12 located on the downstream side of the processing mechanism 40 shrinks.</p>
申请公布号 JP2014203972(A) 申请公布日期 2014.10.27
申请号 JP20130078919 申请日期 2013.04.04
申请人 MURATA MFG CO LTD;ALPHA SYSTEM:KK 发明人 ODA JUNICHI;MASUDA DAIZO
分类号 H01G13/00;H01G4/30 主分类号 H01G13/00
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