发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To enhance productivity while preventing increase in the device area due to large diameter of a workpiece.SOLUTION: A cutting device (1) includes first and second cutting means (8a, 8b) provided on one outside surface (52a) of guide-rail means (52) and movable on a first Y axis guide-rail (61a), and third and fourth cutting means (8c, 8d) provided on the other outside surface (52b) and movable on a second Y axis guide-rail. A first spindle (81a) of the first cutting means and a second spindle (81b) of the second cutting means are disposed in suspension state while facing the cutting blades (82a, 82b) each other, and a third spindle (81c) of the third cutting means and a fourth spindle (81d) of the fourth cutting means are disposed in suspension state while facing the cutting blades (82c, 82d) each other. The first and third spindles, and the second and fourth spindles are constituted movably in parallel in the X axis direction.
申请公布号 JP2014203944(A) 申请公布日期 2014.10.27
申请号 JP20130078333 申请日期 2013.04.04
申请人 DISCO ABRASIVE SYST LTD 发明人 KOZAI HIROHIKO;NAKANISHI YUJI
分类号 H01L21/301;B24B27/06 主分类号 H01L21/301
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