| 摘要 |
PROBLEM TO BE SOLVED: To provide an imide oligomer which allows thermal molding at low temperatures and shows excellent heat resistance and a large rupture elongation as a polyimide resin after thermal hardening.SOLUTION: An imide oligomer consists of 2,3,3',4'-biphenyltetracarboxylic acid di-anhydride, 1,4-bis(4-aminophenoxy)benzene, 3,4'-diaminodiphenyl ether and 1,3-bis(3-aminophenoxy)benzene, and both ends are residues derived from 4-phenylethynylphthalic acid anhydride. |
