| 摘要 |
The reliability of a semiconductor device is improved. In a wiring substrate (2) of a BGA, a plurality of bonding leads (2m) is disposed on an insulation layer (2d). The insulation layer (2d) includes a prepreg (2da) having a glass cloth (2h) and a resin layer (2db) having no glass cloth (2h). The resin layer (2db) is stacked on the prepreg (2da). Thus, the plurality of bonding leads (2m) are directly disposed on the soft resin layer (2db) and are supported by the soft resin layer (2db). When each of the plurality of bonding leads (2m) is pressurized by a load when a flip-chip is mounted, the resin layer (2db) sinks, thereby reducing the stress applied to a semiconductor chip. |
