MOULDING COMPOUND FOR RADIATION-PROOF BOARD MATERIALS AND METHOD FOR PRODUCTION THEREOF

摘要

FIELD: chemistry.SUBSTANCE: invention relates to a moulding compound for producing radiation-proof board materials and a method for production thereof. The invention can be used, for example, producing chipboard and fibreboard materials for making environmentally safe radiation-proof furniture. The moulding compound, depending on dispersity and porosity of the aggregate, contains 22-65 wt % binder by dry substance. The binder is a solution of 4-15 wt % ultrafine active carbon with particle size of 20-80 nm and specific surface area of 50-200 m/g in liquid glass with SiOconcentration of 18-24 wt %, obtained in a mixer/disperser with mixer rotary speed of up to 1700 rpm, stabilised by an additive of 3-6 wt % saturated ammonium lignosulphonate solution. Highly dispersed colloidal graphite can further be added to the binder. The board material is produced by cold pressing or hardening with a weight.EFFECT: presence of effective radiation-absorbing filler in the binder provides improved radiation-protective properties of the obtained board material.3 cl, 1 tbl