COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE SHEET, AND PRODUCTION METHOD OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier in which adhesive force with an electrical insulation substrate is favorable, and an etching property is favorable.SOLUTION: A copper foil with a carrier includes: the carrier; a peeling layer laminated on the carrier; a very thin copper layer laminated on the peeling layer; and an adhesion layer with an electrical insulation substrate laminated on the very thin copper layer. The very thin copper layer is made a square sheet of 10 cm, and when an average value of a weight thickness measured value calculated by a weight thickness method is assumed W, and thickness accuracy is P=3&sgr;×100/Wwith a standard deviation assumed &sgr;, Pis 3.0% or less. In the adhesion layer with the electrical insulation substrate of the very thin copper layer, a roughness Rz measured by a contacting type roughness meter in accordance with JIS B0601-1994 satisfies 1.5 μm or less.