METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component device capable of reducing warpage.SOLUTION: A method for manufacturing an electronic component device includes the steps of: preparing a substrate on which an electronic component is arranged; preparing a resin sheet; preparing a mold having a salient for forming a cut in the resin sheet; forming a laminate by laminating the resin sheet on the substrate; and pressing the laminate by the mold and forming a cut in the resin sheet while sealing the electronic component with the resin sheet.