SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, AND ELECTRONIC CIRCUIT

摘要

PROBLEM TO BE SOLVED: To suppress noise generated in power supply paths to external interface buffers.SOLUTION: A semiconductor device (1) has a semiconductor chip (12A-12C) including a plurality of external interface buffers (10_1-10_n), and a substrate (16A-16C) both sealed in a semiconductor package. The substrate includes a power wire (LVDD), a ground wire (LGND), and a plurality of signal wires (LS_1-LS_n) connected to the plurality of external interface buffers, respectively. The plurality of signal wires are arranged so as to be sandwiched between the power wire and the ground wire in whole or in part. A current path (Iv) leading from the power wire to the signal wire via the external interface buffer and a current path (Ig) leading from the signal wire to the ground wire via the external interface buffer have such an arrangement as to reduce mutual magnetic flux changes.