发明名称 RF MODULE AND MULTILAYER WIRING BOARD INCORPORATING RF MODULE
摘要 <p>PROBLEM TO BE SOLVED: To suppress malfunction of an electronic component by suppressing noise superposing the electronic component without compromising the design flexibility of an RF module, in the RF module incorporating an electronic component, and to further suppress malfunction of the RF module.SOLUTION: An RF module comprises: a first conductor layer and a second conductor layer disposed to face each other via a first insulating member; and an electronic component mounted on the first conductor layer and embedded in the first insulating member. The RF module is configured so that the second conductor layer is superposed on at least a part of the electronic component, and is set to a first fixed potential.</p>
申请公布号 JP2014203952(A) 申请公布日期 2014.10.27
申请号 JP20130078568 申请日期 2013.04.04
申请人 DAINIPPON PRINTING CO LTD 发明人 LIU JIA;TANAKA MASAYA;SAGARA HIDEJI
分类号 H05K3/46 主分类号 H05K3/46
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