| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electric plating method which prevents rapid lowering of the plating speed during embedding and can embed an internally void-free plating metal into via holes even when the concentration of a plating depressor in a plating solution is decreased.SOLUTION: An electric plating method comprises preparing a substrate having a large number of via holes in the surface, immersing the substrate in a pretreatment solution containing a plating depressor to preliminarily execute pretreatment for making the plating depressor adsorbed on the surface of the substrate, immersing the substrate after the pretreatment in a plating solution containing the plating depressor and a plating accelerator in a plating tank to replace the pretreatment solution adhering to the surface of the substrate including the inside of the via holes, with the plating solution, and plating the surface of the substrate electrically to embed the plating metal into the via holes.</p> |
