| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling unit of a workpiece which eliminates the need of a lifting mechanism etc., has a simple structure, shortens the cooling time of the workpiece, and achieves good cooling efficiency.SOLUTION: A reception device 1 of a semiconductor wafer includes: a pair of placement bases 10, 10 which support the semiconductor wafer W cooperatively. The pair of placement bases 10, 10 supports the semiconductor wafer W thereby forming a lower part open space 180a between an area between the pair of placement bases 10, 10 and a lower surface W1 of the semiconductor wafer W and forming an upper part open space 180b above the semiconductor wafer W. The reception device 1 of the semiconductor wafer further includes: a first jet nozzle 116 which jets a cooling gas from the lower side of the lower part open space 180a toward the lower surface W1 of the semiconductor wafer W; and a second jet nozzle 113 which jets the cooling gas from the upper side of the upper part open space 180b toward an upper surface W2 of the semiconductor wafer W. |
