发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for adhesion sealing of a member by heat hardening which solves the problem of non-stability of fluid flow characteristics during storage and has characteristics suitable for adhesion sealing of a member, e.g. a relay.SOLUTION: A curable resin composition comprises (A) 100 pts.mass of an epoxy resin, (B) 0.01-1 pt.mass of a chelating compound, (C) 1-50 pts.mass of an ingredient which hardens the epoxy resin, and (D) 0.5-50 pts.mass of particles of an acrylic rubber.
申请公布号 JP2014201630(A) 申请公布日期 2014.10.27
申请号 JP20130077522 申请日期 2013.04.03
申请人 THREE BOND CO LTD 发明人 KOJIMA KAZUHIRO;HA KHOI-NGUYEN;MORITOKI TATSUYA
分类号 C08L63/00;C08K5/17;C08L51/00 主分类号 C08L63/00
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