| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion apparatus capable of optimizing cooling efficiency of individual semiconductor module.SOLUTION: A power conversion apparatus includes: a laminate 10 in which a plurality of semiconductor modules 2 and a plurality of cooling pipes 3 are laminated; and a pair of pipes 4a, 4b. The pair of pipes 4a, 4b are connected to a cooling pipe 3 positioned at one end part in a lamination direction (X direction) of the laminate 10 among the plurality of cooling pipes 3a. By introducing a refrigerant 11 from one pipe 4a, the refrigerant 11 is split in individual cooling pipes 3, to be guided out from the other pipe 4b. The semiconductor modules 2 are sorted in a plurality of groups G(G1-G3) constituting individual power conversion circuit respectively. A group G of which heating value of the semiconductor module 2 is higher is arranged closer to the pair of pipes 4a, 4b. |
