发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component which allows for enhancement of the yield, and to provide a manufacturing method therefor.SOLUTION: A core 12 comprises: a planar bottom 12a; and a columnar winding core 12b projecting upward from the upper surface of the bottom 12a. A winding 14 is wound around the winding core 12b, and the end thereof is pulled out to the surface of the bottom 12a. In the winding 14, the portion pulled out to the surface of the bottom 12a is dented into the surface of the bottom.</p>
申请公布号 JP2014204054(A) 申请公布日期 2014.10.27
申请号 JP20130081033 申请日期 2013.04.09
申请人 MURATA MFG CO LTD 发明人 HYODO KOICHIRO
分类号 H01F27/29;H01F17/04;H01F41/04 主分类号 H01F27/29
代理机构 代理人
主权项
地址