| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting apparatus with which a wafer can be mounted on a ring frame having a dicing tape adhered thereon, with simple structure.SOLUTION: A mounting apparatus 1 comprises: an upper container 20 and a lower container 10. The upper container 20 and the lower container 10 are relatively movable. The mounting apparatus further comprises: a vacuum container sealed by a container sealing seal member 32 when the upper container 20 and the lower container 10 come close to each other; and an elevation stage 11, arranged in the lower container 10 in a movable way in a vertical direction, on which a wafer is mounted. A separation seal member 31 is arranged on a mounting part on which a ring frame having the dicing tape adhered thereon of the lower container 10. The upper container 20 includes a press mechanism for pressing a ring frame onto the separation seal member 31. The separation seal member 31 and the press mechanism form an upper sealed chamber and a lower sealed chamber which are separated by the dicing tape and maintain airtightness thereof. The dicing tape is adhered onto the wafer using differential pressure of the upper sealed chamber and the lower sealed chamber.</p> |
