| 摘要 |
PROBLEM TO BE SOLVED: To radiate ultraviolet ray to a protective tape while sucking well even with a minute chip after DBG.SOLUTION: A wafer transfer mechanism 1 transfers a wafer W in which a device region 23, in which a plurality of devices 24 are formed by being divided by a plurality of scheduled division lines, and an outer periphery margin region 22 which encloses the device region 23 are formed on a surface 21. It includes at least a transfer pad 10 which has a shape equivalent to a profile of the wafer W and abuts on a rear surface 26 of the wafer W for sucking and holding, and an arm 5 for moving the transfer pad 10. The transfer pad 10 includes a ring-like sucking/holding part 12 which sucks and holds the outer periphery margin region 22 of the wafer W, and a device region abutment part 13 which is enclosed with the sucking/holding part 12 and abuts on the device region 23 of the wafer W. |
