| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of excellent thermal conductivity, and to provide a manufacturing method therefor and an electronic device using the heat dissipation structure.SOLUTION: A heat dissipation structure comprises: a plurality of linear structures 12 of carbon element, some of which are oriented in random direction as a ransom orientation part 16; and a resin layer 20 filling between the plurality of linear structures. One ends 14 of the plurality of linear structures projecting from the ransom orientation part to one side are bent to the same side, and the other ends 18 of the plurality of linear structures projecting from the ransom orientation part to the other side are bent to the same side. |
