发明名称 HOT-ROLLING COPPER PLATE
摘要 PROBLEM TO BE SOLVED: To provide a hot-rolling copper plate which is excellent in processability and a fatigue characteristic even if it is produced by hot rolling, and which can satisfactorily suppress abnormal discharge even when being used for a sputtering target.SOLUTION: A hot-rolling copper plate comprises pure copper in which purity is at least 99.99 mass%, and is characterized in that an average crystal grain size is at most 40 μm, and (&Sgr;3+&Sgr;9) grain boundary length fraction (L(&sgr;3+&sgr;9)/L) that is the fraction of the total crystal grain boundary length L to the sum L(&sgr;3+&sgr;9) of &Sgr;3 grain boundary length L&sgr;3 and &Sgr;9 grain boundary length L&sgr;9 measured by an EBSD method is made at least 28%.
申请公布号 JP2014201814(A) 申请公布日期 2014.10.27
申请号 JP20130080844 申请日期 2013.04.08
申请人 MITSUBISHI MATERIALS CORP;MITSUBISHI SHINDOH CO LTD 发明人 MAKI KAZUMASA;MORI HIROYUKI;ARAI ISAO;IIDA NORIHISA;TAKEDA TAKAHIRO;SHIMOIZUMI SHIGERU;OIKAWA SHIN
分类号 C22C9/00;B21B3/00;C22F1/08;C23C14/34;H01B1/02;H01B5/02 主分类号 C22C9/00
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