发明名称 |
HOT-ROLLING COPPER PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a hot-rolling copper plate which is excellent in processability and a fatigue characteristic even if it is produced by hot rolling, and which can satisfactorily suppress abnormal discharge even when being used for a sputtering target.SOLUTION: A hot-rolling copper plate comprises pure copper in which purity is at least 99.99 mass%, and is characterized in that an average crystal grain size is at most 40 μm, and (&Sgr;3+&Sgr;9) grain boundary length fraction (L(&sgr;3+&sgr;9)/L) that is the fraction of the total crystal grain boundary length L to the sum L(&sgr;3+&sgr;9) of &Sgr;3 grain boundary length L&sgr;3 and &Sgr;9 grain boundary length L&sgr;9 measured by an EBSD method is made at least 28%. |
申请公布号 |
JP2014201814(A) |
申请公布日期 |
2014.10.27 |
申请号 |
JP20130080844 |
申请日期 |
2013.04.08 |
申请人 |
MITSUBISHI MATERIALS CORP;MITSUBISHI SHINDOH CO LTD |
发明人 |
MAKI KAZUMASA;MORI HIROYUKI;ARAI ISAO;IIDA NORIHISA;TAKEDA TAKAHIRO;SHIMOIZUMI SHIGERU;OIKAWA SHIN |
分类号 |
C22C9/00;B21B3/00;C22F1/08;C23C14/34;H01B1/02;H01B5/02 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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