发明名称 BLACK PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a black photosensitive resin composition which has excellent electric insulation reliability, excellent flame retardancy and solder heat resistance at 300°C or higher while being free from discoloration, blistering or peeling.SOLUTION: The black photosensitive resin composition comprises at least (A) a binder polymer, (B) two or more organic pigments, (C) a thermosetting resin, (D) a radical polymerizable compound, (E) a photopolymerization initiator, and (F) a flame retardant. The (F) component shows a weight reduction start temperature of 300°C or higher. The composition contains (B1) an organic pigment having a specific structure as the (B) component.
申请公布号 JP2014202846(A) 申请公布日期 2014.10.27
申请号 JP20130077536 申请日期 2013.04.03
申请人 KANEKA CORP 发明人 KAGA TAKAHIRO;SEKITO YOSHIHIDE;KIDO MASAYOSHI
分类号 G03F7/004;C08F290/06;G03F7/027;G03F7/035;H05K3/28 主分类号 G03F7/004
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