| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin film for a printed wiring board and a production method of the resin film that can impart good dielectric characteristics in a high frequency region to a printed wiring board while sufficiently maintaining solubility of a resin component.SOLUTION: A resin composition is provided, comprising (A) a saturated thermoplastic elastomer having a styrene unit, (B) at least one component selected from the group consisting of an epoxy resin, a cyanate ester resin and a maleimide compound, and (C) preliminarily surface-treated spherical silica. A ratio W/Wof a mass Wof the (A) component to a mass Wof the (B) component ranges from 0.43 to 5.0. The component (C) is obtained through steps of surface treating spherical silica with a first surface treating agent and further surface treating with a second surface treating agent. The first surface treating agent is at least either a silicone oligomer or a vinyl-based silane coupling agent, while the second surface treating agent is an amino-based silane coupling agent. |
