| 摘要 |
PROBLEM TO BE SOLVED: To transfer a wafer without using a mark formed in the wafer, such as a notch or an orientation flat.SOLUTION: A surface protective member 10 having a straight mark 11, indicating a predetermined direction of a wafer 1, is stuck to the surface 1a of the wafer 1. In a sheet sticking step, a sheet 20 is stuck to the back side 1b of the wafer 1 while positioning the straight mark 11 so as to be in parallel with the notch 30b of a frame 30. The wafer 1 can be transferred while making the dividing line (predetermined direction) 3 of the wafer 1 correspond to the notch 30b of the frame 30, by using the straight mark 11 of the surface protective member 10, without using a mark formed in the wafer 1, such as an orientation flat or a notch. |
