发明名称 ABRASIVE MATERIAL AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an abrasive material containing silicon oxide particles used for polishing a sapphire substrate, as abrasive grains, and can combine high polishing speed and excellent quality of polished surface, and to provide a polishing method.SOLUTION: An abrasive material for polishing the polished surface of a sapphire substrate contains 1-15 mass% of silicon oxide particles for the total amount of the abrasive material, a polymer compound having a sulfo group and/or its salt and containing an aromatic ring, and water. A method for supplying the abrasive material to a polishing pad, bringing the polishing pad into contact with the polished surface of a sapphire substrate, and then polishing sapphire substrate by relative motion therebetween is also provided.
申请公布号 JP2014204064(A) 申请公布日期 2014.10.27
申请号 JP20130081117 申请日期 2013.04.09
申请人 ASAHI GLASS CO LTD 发明人 YOSHIDA YUIKO
分类号 H01L21/304;B24B37/00 主分类号 H01L21/304
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