| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction structure, along with a semiconductor element-housing package, capable of reducing occurrence of metalization peeling without degrading strength or reliability in brazing.SOLUTION: Relating to a semiconductor element-housing package 1, a recess 23 is provided on a lower surface of an extension part 13, in a metal member 5 having a configuration in which the extension part 13 extends from a base part 11. Therefore, even if a sufficient brazing material 7 is arranged, an outside fillet 17b of a sufficient size can be formed between an outside metalization layer 21b and an outer peripheral side of the base part 11 of the metal member 5. In short, a tip end of the outside fillet 17b is housed inside the recess 23 even in a case in which the outside fillet 17b of a sufficient size is provided and a tip end of the outside fillet 17b extends much to the extension part 13 side when the metalization layer 21 is jointed to the base part 11 of the metal member 5. Thus, even if a stress (caused by contraction) is applied at the time of contraction of the brazing material 7, peeling of the outside metalization layer 21b is suppressed. |
