| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently encapsulate a semiconductor element by an encapsulation layer composed of a resin composition and manufacture a semiconductor device with high accuracy.SOLUTION: A semiconductor device manufacturing method comprises: attaching on distribution regions of a plurality of semiconductor elements formed on a semiconductor wafer W, a plurality of encapsulation sheet pieces each of which is cut into an area smaller than that of the distribution region and which are cut along a dividing line surrounding the plurality of semiconductor elements C on a whole area of the distribution regions of the semiconductor elements C; holding the semiconductor wafer W which encapsulates the semiconductor elements C by hardening the encapsulation layer, on a ring frame via a dicing tape, and subsequently transferring the semiconductor wafer W to a dicing process; cutting the semiconductor wafer W along dividing lines; and expanding the dicing tape to manufacture semiconductor devices.</p> |
