| 发明名称 |
CONDUCTIVE PARTICLES, ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF PRODUCING CONDUCTIVE PARTICLES |
| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles capable of suppressing the breakage of a plating layer.SOLUTION: A conductive particle comprises a spherical core particle, and a plating layer that covers the core particle, wherein the plating layer comprises carbon nanotube. |
| 申请公布号 |
JP2014203546(A) |
申请公布日期 |
2014.10.27 |
| 申请号 |
JP20130076382 |
申请日期 |
2013.04.01 |
| 申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
AKAI KUNIHIKO;HABA EISUKE;YAMAURA ITARU;UEDA SHUNSUKE;WATANABE YASUSHI |
| 分类号 |
H01B5/00;C09J9/02;H01B1/00;H01B1/22;H01B1/24;H01B5/16;H01B13/00;H01R11/01 |
主分类号 |
H01B5/00 |
| 代理机构 |
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