COPPER FOIL WITH CARRIER

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier that is suitable to fine pitch formation.SOLUTION: A copper foil with a carrier includes: a copper foil carrier; a peeling layer laminated on the copper foil carrier; and a very thin copper layer laminated on the peeling layer. The thickness accuracy of the very thin copper layer measured by a weight thickness method is 3.0% or less, an average value of Rz of a surface of the very thin copper layer measured by a contacting type roughness meter in accordance with JIS B0601-1982 is 1.5 μm or less, and a standard deviation of the Rz is 0.1 μm or less.