| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing method and a plasma processing apparatus which allow for desired plasma processing by gradually changing the dissociation state of the plasma progressively with the passage of the plasma processing time.SOLUTION: In a plasma processing method using a plasma processing apparatus including a plasma processing chamber performing plasma processing of a sample, a first high frequency power supply supplying a first high frequency power for plasma generation, and a second high frequency power supply supplying a second high frequency power to a sample table for mounting a sample thereon, the dissociation state of the plasma is controlled to a desired dissociation state by modulating the first high frequency power with a first pulse, and controlling the duty ratio of the first pulse progressively with the passage of the plasma processing time gradually. |
