| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having good photosensitive properties, and forming a cured film at low final curing temperature, and allowing high weight reduction temperature of the cured film.SOLUTION: A resin composition contains (a) a polyimide precursor having a carbon-carbon unsaturated double bond (represented by the formula (1)), (b) a compound generating a radical by active ray irradiation, (c) a compound having a dimethacrylate structure as methacrylic acid at both terminals of 1 to 3 propylene oxide structures or a compound having a propylene oxide oligomer structure, and (d) a solvent. [In the general formula (1), Rand Rare each independently a hydrogen atom or a monovalent organic group. In this regard, 80% or more of Rand Rin the formula (1) is a monovalent organic group having a carbon-carbon unsaturated double bond.] |
