WIRING BOARD, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of suppressing reduction in yield.SOLUTION: A wiring board 20 comprises: insulating layers 61 and 62 which are formed on the side of an upper surface 30A of a core substrate 30; a wiring layer 72 formed on the insulating layer 62; an insulating film 64 which is laminated on the insulating layer 62, covers the wiring layer 72 and includes a filler; and an insulating layer 65 which is laminated on the insulating layer 64, and does not include filler. The wiring board 20 also has: a via V5 penetrating the insulating layers 64 and 65 in a thickness direction; and a wiring layer 81 which is laminated on the insulating layer 65, and is electrically connected to the wiring layer 72 through the via V5.