| 摘要 |
<p>[Problem] To provide a novel resin composition whereby a plating conductor layer exhibits adequately high peel strength despite the surface of an insulation layer having not only a low arithmetic mean roughness (Ra value) but also a low root-mean-square roughness (Rq value) after a wet roughening process. [Solution] The purpose of the present invention is achieved by a resin composition containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C) which is surface-treated with an epoxy resin.</p> |
