| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire saw that is excellent in processability (productivity) with a long life and cutting capability of a hard material and prevents a metal ion from being bonded to a substrate to be sliced by detachment of a metallic film of a wire surface when sliced.SOLUTION: The wire saw has a wire on a surface of which mixed particles coated with metal, which include diamond microparticles having silicon and/or diamond microparticles having fluorine, or diamond microparticles having silicon and fluorine, are dispersed and bonded, where the wire is plated with metal. |
