| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a copper wiring for wire-connection, capable of protecting a side surface of the copper wiring and shortening a distance between wirings, and a method for manufacturing the same.SOLUTION: A semiconductor device comprising a passivation film 14; a copper wiring 15 for connection of copper wires 5 formed on the passivation film 14; a pedestal film 34 formed so as to surround the copper wiring 15 and selectively covering a lower part of a side surface 28 of the copper wiring 15; a copper seed film 32 arranged between the passivation film 14 and the pedestal film 34 and integrally formed with the copper wiring 15; a Ni film 29 covering an upper surface 27 and the side surface 28 of the copper wiring 15 on the pedestal film 34; and lamination films 29 to 31 consisting of a Pd film 30 and an Au film 31, is manufactured. |
