发明名称 COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component mounting device in which a substrate can be recognized precisely, even when the substrate is recognized by providing a substrate imaging section in a head so that it can move relatively thereto.SOLUTION: A component mounting device 100 includes a head unit 50 which can mount a component sucked to a nozzle 5 on a substrate 1, a substrate imaging unit 70 provided in the head unit 50 so that it can move relatively thereto, and imaging the substrate 1, and a mark member 59 for correction provided in the head unit 50 so that it can be imaged by the substrate imaging unit 70. The component mounting device 100 is configured so that the relative positional deviation of the substrate imaging unit 70 from the head unit 50 can be corrected based on the imaging results of the mark member 59 for correction by the substrate imaging unit 70.
申请公布号 JP2014203938(A) 申请公布日期 2014.10.27
申请号 JP20130078187 申请日期 2013.04.04
申请人 YAMAHA MOTOR CO LTD 发明人 ONISHI MASASHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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