| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve such problems that a resist retracts conventionally to the cutting surface side while etching to form an eaves for a metal film thus forming a taper, and that difference occurs in the etching rate of a metal film due to the position on a substrate in a conventional milling machine, thus causing uneven cutting where the central part of the substrate is cut excessively and the outer periphery is cut insufficiently.SOLUTION: Prior to formation of a wiring pattern, a trench structure is formed on an interlayer insulating film, formation of metal wiring layer and coating of resist are performed, and irregularities are also formed on the resist surface according to the irregularities of the trench. Since a mask resist is concave, retraction by etching progress less than conventional when etching the metal film by milling, thus suppressing formation of a taper.</p> |
