| 摘要 |
<p>Suggested are a light emitting diode package and a manufacturing method thereof, capable of reducing light loss due to light reflection, widening an orientation angel of the light emission, and easily discharging heat. The package includes an LED chip which is mounted on a lead frame to be arranged on a substrate with a preset interval, a sidewall which is formed around the substrate and provides a cavity of a cup structure to mounted on the LED chip, and a sealant which is filled in the cavity. At this time, one region of the sidewall is higher than the other region of the sidewall. The shape of the sealant is controlled by the distribution of the fixing power of the sidewall and the surface tension of a resin.</p> |
