发明名称 INTEGRATED MICROELECTRONIC PACKAGE TEMPERATURE SENSOR
摘要 Temperatures in microelectronic integrated circuit packages and components may be measured in situ using carbon nanotube networks. An array of carbon nanotubes strung between upstanding structures may be used to measure local temperature. Because of the carbon nanotubes, a highly accurate temperature measurement may be achieved. In some cases, the carbon nanotubes and the upstanding structures may be secured to a substrate that is subsequently attached to a microelectronic package.
申请公布号 HK1116537(A1) 申请公布日期 2014.10.24
申请号 HK20080106952 申请日期 2008.06.23
申请人 INTEL CORPORATION 发明人 NACHIKET R. RARAVIKAR;NEHA PATEL
分类号 G01K 主分类号 G01K
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