| 摘要 |
Disclosed are a device and a method related to ground paths realized together with surface mount-devices (SMDs) in order to facilitate a shielding of a radio-frequency (RF) module. In some embodiments, a module can comprise a packaging substrate configured so as to accommodate a plurality of components. The module is disposed on the packaging substrate and can further comprises an RF component configured so as to facilitate treatment for an RF signal. The module can further comprise an RF shield disposed with respect to the RF component, wherein the RF shield is configured so as to shield the RF component. The RF shield can comprise at least one shielding component configured so as to provide at least one electric path between a conductive layer on an upper surface of the module and a ground surface of the packaging substrate. The shielding component can comprise a surface-mount device (SMDs), such as an RF filter, which is realized as a chip size surface acoustic wave (SAW) device (CSSD). |
