| 发明名称 |
Package with a Fan-out Structure and Method of Forming the Same |
| 摘要 |
An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer. The device further comprises a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die, and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound. |
| 申请公布号 |
US2014312492(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414319678 |
申请日期 |
2014.06.30 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
Mao Yi-Chao;Chang Chin-Chuan;Hung Jui-Pin;Lin Jing-Cheng |
| 分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a semiconductor die; an adhesive layer on a first side of the semiconductor die; a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer, the molding compound consisting essentially of a polymer or an epoxy; a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die; and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound. |
| 地址 |
Hsin-Chu TW |
