SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC SYSTEM

摘要

Provided are a semiconductor device, a semiconductor package, and an electronic system. The device includes a substrate having a front side and a back side disposed opposite the front side. An internal circuit is disposed on or near to the front side of the substrate. Signal I/O through-via structures are disposed in the substrate. Back side conductive patterns are disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures. A back side conductive structure is disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures. The back side conductive structure includes parallel supporter portions.

主权项

1. A semiconductor device comprising:
a substrate having a front side and a back side disposed opposite the front side; an internal circuit disposed on or near to the front side of the substrate; signal input/output (I/O) through-via structures disposed in the substrate; back side conductive patterns disposed on the back side of the substrate and electrically connected to the signal I/O through-via structures; and a back side conductive structure disposed on the back side of the substrate and spaced apart from the signal I/O through-via structures disposed in the substrate, wherein the back side conductive structure includes parallel supporter portions.