SEMICONDUCTOR PACKAGE WITH WIRE BONDING

摘要

A semiconductor package having a die having a plurality of electrically continuous die wire bonding sites includes a first die wire bonding site and a second die wire bonding site. The package includes a substrate having a plurality of electrically continuous substrate wire bonding sites including a first substrate wire bonding site and a second substrate wire bonding site. A first bondwire is connected between the first die wire bonding site and the first substrate wire bonding site and a second bondwire is connected between the second die wire bonding site and the second substrate wire bonding site. The first and second bondwires lie in adjacent, substantially parallel bondwire planes. The second bondwire is substantially skewed with respect to said first bondwire.

主权项

1. A semiconductor package comprising:
a die having a plurality of electrically continuous the wire bonding sites including a first die wire bonding site and a second die wire bonding site; a substrate having a plurality of electrically continuous substrate wire bonding sites including a first substrate wire bonding site and a second substrate wire bonding site; a first bondwire connected between first die wire bonding site and said first substrate wire bonding site; a second bondwire connected between said second die wire bonding site and said second substrate wire bonding site, said first and second bondwires lying in adjacent, substantially parallel bondwire planes; and wherein said second bondwire is substantially skewed with respect to said first bondwire.