BOARD, MOUNTING STRUCTURE OF SURFACE MOUNTING COMPONENT, AND ELECTRONIC DEVICE

摘要

A mounting structure of a surface mounting component is configured by connecting the surface mounting component to a board at the vicinity of an end portion by soldering. A concave portion is formed between joint portions for the soldering in a range in which the surface mounting component of the board is mounted.

主权项

1. A mounting structure for a surface mounting component, the mounting structure comprising:
a substrate; a first copper foil layer portion and a second copper foil layer portion disposed on and in direct contact with the substrate, the first copper foil layer portion and the second copper foil layer portions defining a gap therebetween on the substrate, the gap having a first edge at the first copper foil layer portion and a second edge at the second copper foil layer portion; a first contact pad disposed over the first copper foil layer portion and a second contact pad disposed over the second copper foil layer portion, the first contact pad set back from the first edge by a setback region, the second contact pad set back from the second edge by a second setback region; and a first resist portion disposed on and in direct contact with the substrate within the first setback region, and a second resist portion disposed on and in direct contact with the substrate within the second setback region, wherein the gap defines a concave portion of the mounting structure, and wherein the first contact pad and the second contact pad are receptive to mounting of the surface mounting component for electrical connection of the surface mounting component to the mounting structure.