| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method which can easily form an extremely thin chip where a die bonding adhesive is attached to a rear face.SOLUTION: A wafer processing method comprises: a circular recess forming step of grinding a rear face of a wafer by a grinding wheel with a diameter smaller than that of the wafer to form a circular recess and an annular salient which surrounds the recess on the rear face of the wafer; an adhesive filling step of filling the circular recess of the wafer with a liquid die bonding adhesive after performing the circular recess forming step; a temporary hardening step of temporarily hardening the liquid die bonding adhesive after performing the adhesive filling step; a rear face grinding step of grinding a whole area of the rear face of the wafer to make a top face of the annular salient flush with a top face of the temporarily-hardened die bonding adhesive and planarizing the top face of the temporarily-hardened die bonding adhesive after performing the temporary hardening step; and a dividing step of dividing the wafer to form a plurality of chips after performing the rear face grinding step. |
