SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

According to one embodiment, a semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

主权项

1. A method for manufacturing a semiconductor device comprising:
preparing a first frame and a second frame,
the first frame having a first light emitting element and a second light emitting element thereon, andthe second frame having a first light receiving element and a second light receiving element; housing the first light emitting element and the first light receiving element in a first cavity of a die, and the second light emitting element and the second light receiving element in a second cavity of the die, and a portion of the second frame in a gap, the gap being in communication with the first cavity and the second cavity; and forming a first resin body by filling the first cavity, the second cavity, and the gap with a first resin through a runner and a through gate of the die; removing parts of the first resin body in the runner and the through gate; and forming the second resin body that molds the first resin body.