| 发明名称 |
Structure Designs and Methods for Integrated Circuit Alignment |
| 摘要 |
Devices and methods for pattern alignment are disclosed. The device includes an assembly isolation region, a seal ring region around the assembly isolation region, and a scribe line region around the seal ring region, and a plurality of die alignment marks disposed within the seal ring region that are alternately disposed adjacent the scribe line region and the assembly isolation region. |
| 申请公布号 |
US2014312454(A1) |
申请公布日期 |
2014.10.23 |
| 申请号 |
US201414320014 |
申请日期 |
2014.06.30 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Hsien-Wei |
| 分类号 |
H01L23/544;H01L27/02;H01L21/50 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a die including an assembly isolation region, a seal ring region around the assembly isolation region, and a scribe line region around the seal ring region; and a plurality of die alignment marks disposed within the seal ring region that are alternately disposed adjacent the scribe line region and the assembly isolation region. |
| 地址 |
Hsin-Chu TW |
