NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURING PROCESSES

摘要

Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

主权项

1. A method for fabricating an electric device comprising:
placing a plurality of conductive particles into an microcavity array of narrow cavity size distribution; transferring the conductive particles from the microcavity array to an adhesive layer; and disposing the conductive particles in predefined locations in the adhesive layer, and wherein each microcavity of the microcavity array is shaped and sized to allow only one conductive particle to be entrapped in each microcavity of the microcavity array.