发明名称 FILM FORMING METHOD
摘要 The present invention provides a film forming method that can improve the density of a film that is formed. In this film forming method, a film is formed on a substrate by spraying a solution that has been formed into a mist onto a substrate (10). Next, the film forming process is discontinued. Next, the substrate is irradiated with plasma.
申请公布号 WO2014170972(A1) 申请公布日期 2014.10.23
申请号 WO2013JP61401 申请日期 2013.04.17
申请人 TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION;KYOTO UNIVERSITY;KOCHI UNIVERSITY OF TECHNOLOGY 发明人 HIRAMATSU TAKAHIRO;ORITA HIROYUKI;SHIRAHATA TAKAHIRO;FUJITA SHIZUO;KAWAHARAMURA TOSHIYUKI
分类号 C23C16/56;C23C16/44 主分类号 C23C16/56
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