BONDING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method for bonding between a semiconductor chip and a substrate, which can be used in a semiconductor module that can operate at a high temperature.SOLUTION: A bonding method includes the following steps of: applying a boding agent containing Cu particles and Sn particles on a bonding surface of a semiconductor chip or a substrate; combining the bonding surface of the semiconductor chip and the bonding surface of the substrate while interposing the bonding agent; heating at a temperature higher than a melting point of Sn to perform transient liquid phase sintering of Cu and Sn in the bonding agent and make the bonding agent contain a composition containing CuSnand CuSn; and further heating to change CuSnin the bonding agent to CuSn to increase a ratio of the CuSn.