METHOD FOR BONDING CIRCUIT BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To suppress position deviation of molding solder at the time when two circuit boards are bonded with each other while interposing an electronic component such as a semiconductor chip therebetween.SOLUTION: A method for bonding two circuit boards while interposing an electronic component therebetween includes the following steps of: applying liquid having a boiling point lower than a melting point of molding solder on one bonding surface on the circuit board; placing the molding solder on the one bonding surface on which the liquid is applied; matching the one bonding surface on which the molding solder is placed and a bonding surface on the other circuit board corresponding to the one bonding surface; evaporating the liquid at a temperature lower than the melting point of the molding solder; and then melting the molding solder.