| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor laser device capable of sufficiently exhibiting a function of effectively wasting heat generated from a semiconductor chip at drive while suppressing a stress added to the semiconductor chip in a heating/cooling process at manufacture.SOLUTION: A semiconductor laser device 10 comprises a semiconductor chip 7 and a sub mount 1 mounting the same. The sub mount has: a first sub mount member 21 configured by arranging a plurality of columnar bodies mutually separated in a direction parallel to a surface of the semiconductor chip and formed of a high thermal conductivity material; a second sub mount member 11 configured by arranging a frame-like body, which is formed of a material with a thermal expansion coefficient approximate to that of the semiconductor chip, so as to surround an outer periphery of the first sub mount member; and a first bonding member for bonding between the first sub mount member and the second sub mount member, on at least one surface except for a principal surface mounting the semiconductor chip and a rear face on an opposite side to the principal surface.</p> |
