| 摘要 |
Provided is a laser processor capable of fast and highly accurate hole-opening processing which does not produce projecting sections and does not require post-processing such as projecting-section removal, and also capable of avoiding dross adhesion caused by heat concentration. When processing so as to open a circular hole (H) in a substrate (W) via a cutting processing on a closed path (K1), this laser processor executes a procedure for opening a piercing hole (20) in a desired location in a substrate section (Wa) on the inside of the closed path (K1). After forming the piercing hole (20), the laser processor executes: a procedure for performing a cutting processing in which the center of the laser beam surpasses the closed path (K1) and cuts up to a prescribed position (Q1); and a procedure for returning the position of the laser-processing head, in relation to the substrate (W) and while laser irradiation is stopped, to a start position (Q2) along the closed path (K1) and along the path for the procedure in which the center of the laser beam cuts up to the prescribed position (Q1). Thereafter, the laser processor executes a procedure for performing a cutting processing from the start position (Q2) along the closed path (K1). |
